Eliyan Corporation, the US-based chiplet interconnect startup that developed a breakthrough method to enable the technology industry’s highest-performing and most efficient chiplet interconnect, this week announced that it has successfully raised $40 million in a Series A funding round.
Tracker Capital Management, a New York-based venture capital firm that focuses on merging technologies, led this latest funding, with additional investment from Celesta Capital. The startup also received additional investments from strategic investors Intel Capital and Micron Ventures.
According to the company’s press release, the fresh funding will help the company fast-track design works, ramp up testing, and support commercial readiness of Eliyan’s best-in-class chiplet interconnect technology.
Founded in 2021, and based in Santa Clara, California, Eliyan Corporation is a developer of semiconductor interconnects intended to revolutionize chiplet technologies by challenging the status quo in order to unleash the ultimate performance of smart systems of the future.
The company’s NuLink™ PHY and NuGear™ technologies address the critical need for a commercially viable approach to enabling high performance and cost-effectiveness in the connection of homogeneous and heterogenous architectures on a standard, organic chip substrate. It has proven to achieve similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the other drawbacks of specialized approaches.
Eliyan’s first silicon is expected to hit the market in 2023.